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Wafer direct bonding: tailoring adhesion between brittle materials [2010-09-07] |
| Wafer direct bonding: tailoring adhesion between brittle materials Andreas Pl??l* and Gertrud Kr?uter Materials Science and Engineering: R: Reports Volume 25, Issues 1-2, 10 March 1999, Pages 1-88 doi:10.1016/S0927-796X(98)00017-5 | 附件下载 |
