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Ceramic via wafer-level packaging for MEMS [2009-09-21] |
| Ceramic via wafer-level packaging for MEMS 作者: Heck JM (Heck, John M.), Arana LR (Arana, Leonel R.), Read B (Read, Bill), Dory TS (Dory, Thomas S.) 书籍团体作者: ASME 来源出版物: Advances in Electronic Packaging 2005, Pts A-C 页: 1069-1074 出版年: 2005 附件下载 |
