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A finite element study of geometric modifications to reduce thermal mismatc [2009-11-24] |
| A finite element study of geometric modifications to reduce thermal mismatch curvature in wafer bonding 作者: Duraipandi D (Duraipandi, Devasena)1, Heck JM (Heck, John M.), Yee RK (Yee, Raymond K.)1, Lee SJJ (Lee, Sang-Joon J.)1 书籍团体作者: ASME 来源出版物: INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2007, VOL 11 PT A AND PT B: MICRO AND NANO SYSTEMS 页: 333-339 出版年: 2008 附件下载 |
