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Thermal management materials for 3D-stacked integrated circuits [2026-01-09] |
| Woon, WY., Kasperovich, A., Wen, JR. et al. Thermal management materials for 3D-stacked integrated circuits. Nat Rev Electr Eng 2, 598–613 (2025). https://doi.org/10.1038/s44287-025-00196-0 Thermal_management_materials_for_3D-stacked_integrated_circuits.pdf |
