首 页 >> 单篇全文
Two Packaging Solutions for High Temperature SiC Diode Sensors [2024-08-23] |
G. Brezeanu1,a *, F. Draghici1,b, M. Badila1,c , F. Craciunoiu2,d, G. Pristavu1,e, R. Pascu2,f, F. Bernea3,f 1 University “POLITEHNICA” Bucharest, Romania, 2 National Institute for R&D in Microtechnology, IMT- Bucharest, Romania, 3 Carpatcement Holding, Romania, a,*gheorghe.brezeanu@dce.pub.ro, b florin.draghici@dce.pub.ro, cmarian.badila1@yahoo.com eFlorin.Bernea@carpatcement.ro Keywords: High temperature sensor, package, gold wire, piston contact Two_Packaging_Solutions_for_High_Temperature_SiC_Diode_Sensors.pdf |