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Two Packaging Solutions for High Temperature SiC Diode Sensors
[2024-08-23]

G. Brezeanu1,a *, F. Draghici1,b, M. Badila1,c ,  F. Craciunoiu2,d, G. Pristavu1,e, R. Pascu2,f, F. Bernea3,f 1 


University “POLITEHNICA” Bucharest, Romania, 2 National Institute for R&D in Microtechnology,  IMT- Bucharest, Romania, 3 Carpatcement Holding, Romania,  a,*gheorghe.brezeanu@dce.pub.ro, b florin.draghici@dce.pub.ro, cmarian.badila1@yahoo.com eFlorin.Bernea@carpatcement.ro  


Keywords: High temperature sensor, package, gold wire, piston contact


Two_Packaging_Solutions_for_High_Temperature_SiC_Diode_Sensors.pdf