Semiconductor Wafer Bonding 9: Science, Technology and Applications [10/11/03]
Rat brain slicer. A simple device for rapidly obtaining serial slabs of fre [10/11/03]
A simple tissue slicer [10/11/03]
Investigation and compensation of the nonlinearity of heterodyne interferom [10/11/03]
Enclosed pillar arrays integrated on a fluidic platform for on-chip separat [10/11/02]
Evaluation and Application of Optical Fiber Pressure Sensor as a new Real T [10/11/02]
Stress compensation techniques in thin layers applied to silicon micromachi [10/11/02]
Room-Temperature Detection of a Single Molecule’s Absorption by Phototherma [10/11/01]
Physical Phenomena in Real Time [10/11/01]
Passivation and corrosion of microelectrode arrays [10/10/29]
Optical Investigations of Directly Wafer-Bonded InP–GaAs Heterojunctions [10/10/29]
Sov.Phys.JETP 53,1201(1981) [10/10/29]
Optical rectification and photon drag in p-type GaAs at 10.6 pm and 1.06 pm [10/10/29]
L.Ivchenko and G.E.Pikus, Pis'ma Zh.Eksp.Teor.Fiz.27,640(1978)[JETP Lett.27 [10/10/29]
Interfacial Behavior of Surface Activated p-GaP/n-GaAs Bonded Wafers at Roo [10/10/29]
Recent progress in interface modification for dye-sensitized solar cells [10/10/29]
Recent developments in thermoelectric materials [10/10/28]
GaN/AlGaN紫外探测器的制备与光电特性研究 [10/10/28]
Scripta Metallurgica, 1969,3,313~,Russell [10/10/28]
Proceedings of the Royal Society of London, 1940, 175,519~, Nabarro [10/10/28]
首 页  上一页  下一页  尾 页  转到第 页  页数:264/340