首 页 >> 单篇全文
Stress compensation techniques in thin layers applied to silicon micromachi
[2010-11-02]
标题: Stress compensation techniques in thin layers applied to silicon micromachining
作者: Lang, W.; Muck, G.; Rose, E., et al.
会议信息: Amorphous Insulating Thin Films Symposium, 日期: Boston, MA USA
来源出版物: Amorphous Insulating Thin Films Symposium|Amorphous Insulating Thin Films Symposium   页: 119-25|xii+636   出版年: 1993


附件下载