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Low Temperature Direct Bonding of InP and Si 3N 4 coated Silicon Wafers for [2012-10-12] |
| 题名: Low Temperature Direct Bonding of InP and Si 3N 4 coated Silicon Wafers for Photonic Device Integration 来源: Journal of the Electrochemical Society [0013-4651] Yadong Wang 年: 2012 volume 159, issue 5, H507-H510 附件下载 |
