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The integration of RF passives using thin-film technology on high-ohmic Si [2011-04-19] |
| The integration of RF passives using thin-film technology on high-ohmic Si in combination with thick-film interconnect Auteur(s) / Author(s) VAN BEEK Joost (1) ; VAN DELDEN Marc (1) ; JANSMAN Andre (1) ; BOOGAARD Arjen (1) ; KEMMEREN Anton (1) ; PULSFORD Nick (2) ; DEN DEKKER Arnold (2) ; International symposium on microelectronics, Baltimore MD , ETATS-UNIS (09/10/2001) 2001 , vol. 4587, pp. 467-470[Note(s) : XIX, 782 p., ] (bibl.: dissem.) ISBN 0-8194-4317-4 附件下载 |
