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Low-temperature (below T(g)) thermal bonding of COC microfluidic devices us [2011-10-20] |
| Title: Low-temperature (below T(g)) thermal bonding of COC microfluidic devices using UV photografted HEMA-modified substrates: high strength, stable hydrophilic, biocompatible surfaces Authors: Roy, S; Yue, CY; Venkatraman, SS; Ma, LL Author Full Names: Roy, Sunanda; Yue, C. Y.; Venkatraman, S. S.; Ma, L. L. Source: JOURNAL OF MATERIALS CHEMISTRY 21 (38): 15031-15040 10.1039/c1jm11750e 2011 附件下载 |
