Semiconductor Packaging: Materials Interaction and Reliability [2013-05-31] |
Semiconductor Packaging: Materials Interaction and Reliability 索书号 TN6/C518 In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. |
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