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Solid State Technology WaferNews October 5, 2010
[2010-10-08]
Solid State Technology WaferNews |View online| October 5, 2010|Forward to a Friend
SST Wafernews Newsletter | October 5

SST Exclusives
Wet cleaning improvements for Si surface preparation
Simple but effective enhancements to wet clean steps can help achieve more stringent surface preparation and reduce complexity, cost-of-ownership, and environmental concerns, writes Robert Pagliaro from RP Innovative Engineering Solutions.
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Achieving cost, performance goals using 3D semiconductor packaging
SoC and 3D multiple die packaging can significantly improve performance and function-to-area ratio, but Vern Solberg from STC urges close examination of the tradeoffs.
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Litho materials infrastructure from a collaborative research approach
Warren Montgomery and Stefan Wurm detail how SEMATECH's toolset and collaborative approach is keeping lithography moving forward by bridging the lapse between basic research and wafer fab production processes.
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News & Analysis
iSuppli trims forecast on soft demand, inventories
Just two months after beefing up its semiconductor sales forecast because of the sector's "roid rage," iSuppli has put those numbers on a cooldown rep, citing concern over end-user demand vs. inventories. This article also includes outlooks for silicon shipments and Chinese chip consumption.
MORE MARKET ANALYSIS: SIA: August IC growth mixed, but forecasts still in line
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3D roadmaps begin to converge
Last month's SEMICON Taiwan 3D Technology Forum shed some insight into what several foundries, assembly houses and customers are thinking about the timing for 3D interposers and full 3D IC, reports Phil Garrou.
MORE TECH UPDATES:
- CEA-Leti, CMP launch MPW for 20nm FDSOI
- New tech enables polyimide crosslink temp control
- Keithley updates ACS parametric test software
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Intel gets Israeli backing for 22nm fab upgrade
The Israeli government is giving Intel hundreds of millions of dollars to infuse its 300mm/45nm fab in Kiryat Gat. What does it mean for Intel's fab plans in other regions?
MORE BUSINESS TRANSACTIONS:
- TSMC gets nod to upgrade Shanghai fab to 130nm
- Mapper Litho gets EC to fund e-beam efforts, cites VC "failure"
- Swedish nanowire LED firm GLO lands $25M funding, eyes US center
- MStar Semi seeks $325M from Taiwan bourse listing
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Destination Nano: Driving research into sensors, devices
Researchers gathered in Lowell, MA for two days in late September (though it felt like midsummer) at an event dubbed "Destination Nano," to discuss key themes around nanotechnology research and applications. From these excellent discussions emerged three themes: research work, safety/health concerns, and nanotech's application specifically in defense/military.
SEE ALSO:
- Leti demos CMOS-compatible plasmonic optical tech
- CVD Equipment receives $2.5M orders for First Nano products
- Honeywell boosting capacity for sputtering targets, metals
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WaferNEWS FAB 50
WaferNEWS Watch: ASML bucks SCE slide, TI lifts AEHR
ASML is gaining significant share at Intel and Samsung and is set up to significantly outperform the chipmaking tool sector as a whole, reports one analyst. And Aehr Test is bullish thanks in part to Texas Instruments' rescue of a Spansion Japan facility.
Market Diary: Most active issues
ADVANCES...................17
DECLINES.....................24
UNCHANGED..................7
NEW HIGHS....................4
NEW LOWS.....................1

LARGEST DOLLAR GAINER................Nanometrics Inc (H)................................0.75
LARGEST DOLLAR LOSER.................Veeco Instruments Inc...........................-1.81
LARGEST PERCENTAGE GAINER......BE Semiconductor Industries NV (H)......13.40%
LARGEST PERCENTAGE LOSER.......Aetrium Inc..........................................-11.40%


................................................................................................NET............PERCENT
.............................................................................................CHANGE........CHANGE
........................................................Close............Close.............IN...................IN
......................................................9/27/10.........9/23/09.........PERIOD..........PERIOD

WaferNEWS Mat & Equip Index.........218.73...........220.05..........-1.32..............-0.60%
WaferNEWS Chipmakers...................120.26...........124.36..........-4.10..............-3.30%
Philadelphia Semiconductor...............343.12...........343.80..........-0.68...............-0.20%
Nasdaq Composite Index.................2344.52.........2369.77.........-25.25..............-1.07%
NYSE Composite............................7272.53.........7263.37............9.16...............0.13%